Classification and characteristics of SM

With the development of electronic science and technology, electronic products in different categories are gradually meeting people's needs. The development of electronic products can be manifested as powerful functions and intelligent and miniaturized software, so the circuit is more and more complex and the chip integration is also more and more high, which has higher and higher requirements on the appearance and mounting of electronic products. In chip production, this trend can be reflected in the miniaturization and high integration of components, such as 01005 and 0201, chip size integrated packaging (CSP), flip chip (FC), ball gate array packaging (BGA), stack packaging (PiP), and the increase in the variety and number of components. Faced with such a trend, the electronic processing industry can do what kind of products, capacity can achieve how much, the environmental and electrical requirements will depend on the placement machine technical parameters. As one of the key equipment in the electronic industry, the SMT placement machine has been improving continuously since it was introduced in the 1980s. Up to now, dozens of famous manufacturers have produced more than 100 kinds of SMT placement machine. With the increasing microminiaturization of electronic components and the increasingly close development of multi-pin, fine spacing and mounting orientation of electronic components, the precision and speed requirements of the placement machine are getting higher and higher. With the development trend of many kinds of electronic products with small batch, the demand for flexibility of mounting equipment is increasing day by day. Faced with numerous placement machine series, types and models, manufacturers how to choose, what kind of placement machine is the most suitable for the needs of the enterprise? Can accuracy and speed be achieved at the same time? Can speed and flexibility compromise? The main classification and structural characteristics of knowledge, to provide basic ideas for users.

Placement machine classification

The basic principle of all placement machines is the same, which is to achieve the installation of components through the basic steps of circuit board entry, positioning, component absorption, identification and mounting. With the development of mounting skills, various placement machine r & d, manufacturers developed a variety of placement machine to meet the needs of the market. In addition to the above mentioned three different stages of the placement machine, according to different shopping malls, different characteristics of various products, different requirements for production characteristics, and different design concepts of equipment manufacturers, the placement machine can be divided into different varieties in terms of speed and function.

1 classification by speed

According to the speed of the placement machine generally does not have a specific boundary, according to custom, according to the mounting speed of components generally can be divided into the following?

(1) medium-low speed placement machine

The theoretical mounting speed of medium-low speed placement machine is below 30000 pieces /h(chip element). Medium-low speed Placement Machine is generally referred to as mid-range Placement Machine. The medium speed placement machine mostly adopts arch frame structure (see 2.22 arch frame structure), which is relatively simple in structure, poor in mounting accuracy, small in area and low in environmental requirements. Generally in the planning and production will consider the cost, and strive to meet the needs of general consumer electronics production and general industrial and commercial electronic equipment production, to achieve both mounting function and cost. As a result of the above reasons, medium speed placement machine in some small and medium-sized electronic production and processing enterprises, research and planning center and product characteristics of many varieties of small batch production enterprises widely used. In the early stage of the development of external mounting skills, placement machines with patch speed above 14,000 pieces /h can be called high-speed placement machines, such as CP2 and TCMV800 machines. With the development of external mounting skills and automation skills, the speed and precision of the placement machine is getting higher and higher, and the standard of high-speed placement machine has been improved. Now it is widely accepted that the theoretical speed of the medium speed Placement Machine, for example, the Ad Vantis AC30 of the universal instrument has reached 30,000 pieces /h, and some Placement Machine can be used for mounting large components, high precision components and heterotype components, as well as small chip shape components This Placement Machine belongs to multi-function Placement Machine in terms of Function, but their theoretical speed is between 300 and 20,000 pieces /h, so they are classified as medium-speed Placement Machine according to the speed.

(2) high-speed Placement Machine

The theoretical mounting speed of high-speed Placement Machine is 30,000-60000 pieces /he high-speed Placement Machine is mainly used to mount small chip components and small integrated components. Some high-speed Placement Machine also have the function of small mounting spherical matrix components (BGA).The turret structure is often used in the structure of high speed Placement Machine. Also more choose complex structure. In the planning of high-speed machine, the mounting speed and stability are mainly taken into account. High-speed  placement machine  is widely used in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises. Like the medium-speed placement machine , with the development of scientific skills, the speed of high-speed  placement machine  is getting faster and faster, and the speed of high-speed  placement machine  has increased from 14,000 tablets /h to nearly 60,000 tablets /h. The placement machine planning also from the main consideration of speed, development to consider the high mount precision, high reliability, multi-function, easy to operate and maintain and can quickly replace products and other aspects

(3) ultra-high speed Placement Machine

The theoretical mounting speed of ultra-high-speed placement machine  is higher than 60000 pieces /h, which is also the  placement machine  with higher speed developed on the basis of high-speed  placement machine . In addition to small chip components and small integrated components, some of these placement machines can also mount spherical matrix components (BGA). In addition, some ultra-high speed  placement machine is equipped with high precision and multi-function mounting head, becoming a high speed and multi-function placement machine that can mount both small components and large high-precision and special-shaped components at high speed. The structure of ultra-high speed placement machine generally has compound structure and large parallel structure. The earlier period of the representatives of the ultra-high speed machine is made large parallel structure Assemble on FCM and Siemens HSs0 with double work platform. In recent years, each major placement machine supplier has launched their own ultra-high speed placement machine, for example, KAYO placement machine. The mounting speed of large parallel ultra-high-speed  placement machine is related to the number of modules. For example, a large parallel ultra-high-speed placement machine can be equipped with 20 modules, and the maximum theoretical mounting speed can reach 150,000 pieces /h.

Kaiyang six head automatic SMT machine

reference

1] SMT machine operation, programming and maintenance manual. Universal Instruments Corp.

2) zhang wendian. Practical surface mount technology (3rd edition). Beijing: electronic industry press,2010

5] wang tianxi, wang yuming SMT machine and its application: electronic industry press,2011

4 EMasia electronics manufacturing.2006 -2011

5) electronic technology, 2000-2011