Pick and place machine work-flow

Through absorption, displacement, positioning, placement and other functions, the mounter can quickly and accurately mount SMC/SMD components to the specified solder pad position of PCB according to assembly process requirements without damaging components and printed circuit boards. The basic process is described as follows.
1. The PCB to be installed enters the transmission track, the sensor at the track entrance finds the PCB, and the system tells the conveyor belt to operate the motor and send the PCB to the next position.

2. The PCB enters the starting point of the operation area, and the transfer equipment will send the PCB into the placement position, triggering the sensor of the placement position when it is about to be in place, and the system controls the corresponding organization to make the PCB stay at the predetermined placement position.Position the PCB in the predetermined position when the machine is operating.Clamping equipment operation, clamping PCB fixed, prevent PCB movement.

3. PCB positioning equipment operation, determine the PCB azimuth is in the predetermined azimuth, otherwise, fix the PCB azimuth coordinate system coordinate system.

4. Check the processing optical discriminant mark point (Mank) according to the program setting, and determine the PCB orientation.

5. Components packed in a special feeder are transported or prepared to a predetermined location according to a programmed location.

6. The tip suction nozzle is moved to the position of pickup element, the vacuum is opened, and the suction nozzle is lowered to absorb element.

7. Vacuum pressure sensor or photoelectric sensor to detect whether the suction element.

8. Through the camera or photoelectric sensor to detect the height of the element (vertical direction).

9. Through the camera or photoelectric sensor detection component corner (horizontal direction), and identify the component features, and then read the component feature values pre-set in the component database, the practice value and the detection value, so as to judge the component features.When the characteristic value does not match, the fault of the pick up element is judged and the pick up from scratch.If so, the current center orientation and rotation Angle of the element are calculated.

10. Throw the faulty element into the scrap collection box.

11. According to the program, adjust the Angle of the element through the rotation of the film head;Adjust the XY direction coordinates to the direction set by the program through the movement of the mounting head or PCB, so that the center of the component coincides with the mounting position.

12. The nozzle descends to a preset height, the vacuum is closed, the element falls, and the mounting is completed.

13. Cycle from step 5 until the installation is complete.

14. The patch part moves to the unloading position and transfers the installed PCB to the unloading track.The sensor at the starting position of the unloading track is triggered, and the control system tells the conveyor motor to operate, sending the PCB to the next position until it is sent out of the machine.