Main production process and advantages o

With the development of industry and the continuous increase of labor cost, SMT production line has become the choice of more and more enterprises.Today we will briefly talk about the main production process and advantages of SMT production line.

Process:

Basic technology of SMT components: semi-auto solder paste mixer -- -- > > solder paste printing -- -- > feeder machine -- -- -- -- > > parts pasted on the shuttle -- -- > reflow welding machine table -- -- > > tubing AOI optical detection - > the lower

Now let's talk about the functions of the main equipment in the main SMT production line

The eight-head mounter is working

1. Solder paste printing: its function is to misprint the solder paste onto the solder pad of PCB to prepare for the welding of components. The equipment used is silk screen printing machine, which is located at the front end of SMT production line.

2. Placement machine: the function is to install the surface assembled components to the fixed position of PCB accurately. The equipment used is a placement machine located behind the solder paste printing machine in the SMT production line.

3. Reflow oven: the function of reflow welding is to melt the solder paste, so that the surface assembly components and PCB boards are firmly bonded together. The equipment used is a reflow soldering furnace located behind the placement machine in SMT production line.

4. AOI optical detection: its function is to test the welding quality and assembly quality of assembled PCB boards. The equipment used is automatic optical detection (AOI), the order quantity is usually more than ten thousand, the order quantity is small through manual detection. The location can be configured in the appropriate place of the production line according to the needs of inspection. Some are before and some are after reflow soldering.

Advantages of SMT patch processing:

High assembly density, electronic products small volume, light weight.

High reliability and strong seismic resistance. Solder joint defect rate is low.

Good high frequency performance. Reduced electromagnetic and radio frequency interference.

Easy automation; Improve production efficiency; Reduce costs; Save materials, energy, equipment, manpower, time, etc.